A micro-indenter consisting of a piezo-electric driven flat cylindrica
l punch has been used to measure the dynamic mechanical properties of
polystyrene films as thin as 50 mu m. The measured viscoelastic respon
se was sensitive to the bonding of the polystyrene to an underlying si
licon substrate for films which were thinner than one indenter diamete
r. The instrument therefore was shown to have practical use in measuri
ng the dynamic mechanical response of polymer films, and the strength
of bonding between disparate materials.