N. Materer et al., LASER SINGLE-PHOTON IONIZATION MASS-SPECTROMETRY MEASUREMENTS OF SICLAND SICL2 DURING THERMAL ETCHING OF SI(100), Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 15(4), 1997, pp. 2134-2142
Citations number
40
Categorie Soggetti
Physics, Applied","Materials Science, Coatings & Films
Pulsed laser single-photon ionization time-of-flight mass spectrometry
is used to investigate the etch products resulting from thermal etchi
ng of Si(100) with molecular chlorine over a temperature range of 1023
-1373 K and a pressure range of 10(-5)-10(-4) Pa. In this regime, two
thermal etch products, SiCl2 and SiCl, are directly observed by ioniza
tion without fragmentation using 118 nm light. Over this temperature a
nd pressure range, the desorption fluxes of SiCl2 and SiCl are proport
ional to the dosing chlorine pressure. A phenomenological activation e
nergy of 0.36+/-0.03 eV is observed for the SiCl desorption flux from
an Arrhenius plot. The SiCl2 product flux exhibits a complex temperatu
re dependence, first. increasing and then decreasing, and thus this ra
te is controlled by at least two pathways. One pathway in the lower te
mperature regime may be a direct desorption channel. The other process
at higher temperatures may be a competing reaction that limits the pr
ecursor species, most likely SiCl, for the formation of SiCl2 on the s
urface. The ability to detect the radical species without mass spectra
l cracking provides the potential to unravel such complex pathways. (C
) 1997 American Vacuum Society.