DEPOSITION OF COPPER-FILMS BY AN ALTERNATE SUPPLY OF CUCL AND ZN

Authors
JUPPO M RITALA M LESKELA M
Citation
M. Juppo et al., DEPOSITION OF COPPER-FILMS BY AN ALTERNATE SUPPLY OF CUCL AND ZN, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 15(4), 1997, pp. 2330-2333
Citations number
22
Categorie Soggetti
Physics, Applied","Materials Science, Coatings & Films
Journal title
Journal of vacuum science & technology. A. Vacuum, surfaces, and films → ACNP
ISSN journal
07342101
Volume
15
Issue
4
Year of publication
1997
Pages
2330 - 2333
Database
ISI
SICI code
0734-2101(1997)15:4<2330:DOCBAA>2.0.ZU;2-W
Abstract
Deposition of copper thin films by an alternate supply of CuCl and Zn was examined. Due to a reversible dissolution of Zn into the Cu film, no self-limiting growth characteristic for the atomic layer epitaxy me thod could be achieved. The resulting films contained about 3 at. % zi nc while chlorine residue contents were below 0.5 at. %. The films wer e polycrystalline consisting of rather coarse grains. (C) 1997 America n Vacuum Society.