Green packages - Requirements, materials, results

Green packages. i.e. lead-free and halogen-free semiconductor components re quire the evaluatation of a lot of new materials and processes. Results con cerning solder plating, ball attach and the properties of halogen-free mold compounds are introduced. It is shown that the materials are available and work well besides some improvements that have to be done. Temperature for ball attach and shear strength of lead-free balls meets the requirements. T he solder platings cannot perform the same wetting behaviour as SnPb-platin g against SnPb-solder but work well with lead-free solders. Halogen free mo ld compounds offer good chances to replace halogenated flame retardants.