Board level reliability testing of mu BGA (R) packaging with lead-free solder attachment

To maximize the benefit of chip-scale packaging for portable and hand-held electronics, the user must consider efficient and cost effective assembly p rocessing. Factors that an engineer should review before developing the pro duct using CSP may include physical features and construction of the device , environmental limitations, suitable substrate materials and a general und erstanding attachment methodology. Many of the electronic products being de veloped using miniature chip-scale package are moving toward lead-free, env ironmentally safe assembly processes. This paper will review chip-size Flash and RAMBUS memory test device applic ations utilizing mu BGA (R) package technology, explore alternative solder alloy compositions, furnish recommendations for solder process temperature profiles and present the results from extensive thermal cycle testing, comp aring eutectic solder to lead-free solder ball contacts and attachment mate rials.