Microelectronic packaging and assembly roadmap for Hong Kong and Pearl River Delta region: A team study and recommendations

Authors
Tummala, RR Wong, CP Chan, YC
Citation
Rr. Tummala et al., Microelectronic packaging and assembly roadmap for Hong Kong and Pearl River Delta region: A team study and recommendations, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 21-23
Categorie Soggetti
Current Book Contents
Journal title
PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE → ACNP
Year of publication
2000
Pages
21 - 23
Database
ISI
SICI code
Abstract
This study is about microelectronic packaging in Hong Kong and Pearl River Delta. It was undertaken at the request of the Department of Industry and T rade and was assigned to Prof Y. C. Chan of City University of Hong Kong. I t lasted about one year and involved over 100 experts from industry, academ ia and government. The study makes a number of recommendations for the acad emic community to do, for the industry to do and the government to do.