New hardware tools for the thermal transient testing of packages

The paper presents a new thermal transient tester, which has unique feature s, both in the hardware design both in the evaluating software. Those featu res are presented in the paper that have general significance and scientifi c advance in the thermal transient measurement technique. Thermal test dies are related devices to support the thermal characterisation IC packages an d packaging technologies. The aim of out work was to provide a set of actua l test dies as well as IP designs of a scaleable size, starting from 2*2mm( 2) through 6*6mm(2) up to a size of 24*24 mm(2), to cover the widest possib le field of applications. The new features of this test die series are also presented in the paper, together with some application examples.