Numerical modeling of microscale heat conduction effects in electronic package for different thermal boundary conditions

The reduction of semiconductor device size to submicrometer range leads to unique electrical and thermal phenomena. Fourier conduction effect was not enough to explain the phenomena and we need to bring in non-Fourier conduct ion effects to analyse micro-electronic devices A two-phase lag model is us ed here to bring in the non-Fourier effects. A numerical solution procedure based on the finite element method and fourth order Runge-Kutta time march ing procedure has been employed for the spatial and temporal discretisation s respectively. The predicted results for different boundary conditions, cl early capture thermal wave-like and pure diffusion type phenomena in the ap propriate range of time lag values. In electronic packaging, the heat condu ction in microscale have to he considered in view of higher heat fluxes enc ountered in recent time especially when we deal with transient heat transfe r. A two dimensional case is considered as a first step. The results are en couraging.