Experimental and finite element analysis of cavity down BGA package solderjoint reliability

Solder joint reliability is one of the most critical issues for successful application of EGA package in electronic industry. In this study, both temp erature cycle test and finite element analysis were used to analyze the sol der joint thermal fatigue life of a fine pitch Cu-based cavity down EGA. Th ree board level reliability results on a cavity down Cu based EGA with 680 ball show that it meets the commercial applications requirements of the ind ustry. The three dimensional (3D) finite element slice model based on volum e weighted average viscoplastic strain energy accumulated per temprature cy cle for the interface elements has been successfully applied to FG680. The model is useful for future assembly parameters evaluation in very short per iod.