Performance of wire-on-tube heat exchangers used in immersion cooling for electronic packages

In the preset investigation, a closed loop immersion cooling of an electron ic package with external condenser-a wire-on-tube heat exchanger being atta ched to its enclosure, is analysed. The dielectric vapour leaving the enclo sure flows through the tubes of the heat exchanger. The vapour is cooled by ambient air in free or forced convection environment. The finite element method is used in the analysis. The dielectric fluid use d is FC-72. The effects of parameters like the length of the tube, ambient temperature, mass flow rate of the dielectric fluid, etc, on the performanc e of the heat exchanger have been studied. The results are also presented i n the form of epsilon -NTU curves. The proposed method may be used to check the adequacy of the number of tubes provided in the existing wire-on-tube heat exchangers for complete condensation of the vapour when the operating conditions are different from the design conditions.