COMPARISON OF ADHESION AND INTRINSIC STRESS OF CHOPPED AND NON-CHOPPED ZNS THIN-FILMS

The adhesion and intrinsic stress of chopped and non-chopped ZnS thin films in the thickness range 50 to 200 nm and the changes occurring du e to exposure to moisture, heat (120 degrees C) and air (30 days) are reported in this paper. The preambient adhesion is higher and the intr insic stress substantially lower for chopped ZnS films, The post-ambie nt changes in adhesion and intrinsic stress are less For the chopped f ilms. Chopping seems to increase preferential orientation and to assis t in the grain growth, so that structural inhomogeneities are reduced. Reduction of voids and defects also occur as a result of chopping the reby improving the mechanical properties.