A COMPUTER-AIDED-DESIGN FRAMEWORK FOR MODELING AND SIMULATION OF VLSIINTERCONNECTIONS AND PACKAGING

The higher speed requirement and rising complexity of interconnect and packaging structure in a VLSI system have increased the necessity of applying modeling and simulation techniques to develop CAD tools for a nalysis and design. To effectively manage design data and CAD tools in volved for modeling and simulation of electronic packaging, a framewor k which provides different levels of services and abstractions is esse ntial. This paper describes a computer-aided design framework which pr ovides three levels of services for the aforementioned purposes. The f irst level of the framework supports CAD tool integrations and simulat ion management. A common graphical user interface is provided for the simulation environment. In the second level, design data representatio n and management are stressed. We applied an object-oriented approach to develop design libraries and encapsulate CAD tools. The third level of the framework emphasizes system level modeling and simulation for multiple chip systems. The underlying architecture and implementation of the framework are explained, design examples given.