ELECTROTHERMAL AND LOGI-THERMAL SIMULATION OF VLSI DESIGNS

Citation
V. Szekely et al., ELECTROTHERMAL AND LOGI-THERMAL SIMULATION OF VLSI DESIGNS, IEEE transactions on very large scale integration (VLSI) systems, 5(3), 1997, pp. 258-269
Citations number
22
Categorie Soggetti
Computer Sciences","Engineering, Eletrical & Electronic","Computer Science Hardware & Architecture
ISSN journal
10638210
Volume
5
Issue
3
Year of publication
1997
Pages
258 - 269
Database
ISI
SICI code
1063-8210(1997)5:3<258:EALSOV>2.0.ZU;2-G
Abstract
Due to severe thermal problems of today's VLSI integrated circuits the need for reliable and quick thermal, electro-thermal and logi-thermal simulation tools is increasing, In this paper, we discuss the latest advances in the SISSI package (simulator for integrated structures by simultaneous iteration) which is a tool developed originally for analo g VLSI design, The improvements include electro-thermal ac and transie nt simulation and the consideration of the thermal voltage of Si-Al co ntacts, Furthermore, we introduce a new module of SISSI, LOGITHERM, wh ich is aimed at the self-consistent logic and thermal simulation of la rge digital VLSI designs, The features of our simulator package are hi ghlighted by simulation examples that are compared in most cases with measurement results.