V. Szekely et al., ELECTROTHERMAL AND LOGI-THERMAL SIMULATION OF VLSI DESIGNS, IEEE transactions on very large scale integration (VLSI) systems, 5(3), 1997, pp. 258-269
Due to severe thermal problems of today's VLSI integrated circuits the
need for reliable and quick thermal, electro-thermal and logi-thermal
simulation tools is increasing, In this paper, we discuss the latest
advances in the SISSI package (simulator for integrated structures by
simultaneous iteration) which is a tool developed originally for analo
g VLSI design, The improvements include electro-thermal ac and transie
nt simulation and the consideration of the thermal voltage of Si-Al co
ntacts, Furthermore, we introduce a new module of SISSI, LOGITHERM, wh
ich is aimed at the self-consistent logic and thermal simulation of la
rge digital VLSI designs, The features of our simulator package are hi
ghlighted by simulation examples that are compared in most cases with
measurement results.