ELECTROTHERMAL CIRCUIT SIMULATION USING SIMULATOR COUPLING

The paper presents a methodology for simulating the static and dynamic performance of integrated circuits in the presence of electro-thermal interactions on the integrated circuit die, The technique is based on the coupling of a finite element method (FEM) program with a circuit simulator, In difference to other known simulator couplings a time ste p algorithm is used, Its implementation into simulation tools is descr ibed, The thermal modeling of the die/package structure and the extend ed modeling of the electronic circuit is discussed, Simulation results which indicate the capabilities of the methodology for electro-therma l simulation are compared to experimental results.