FINITE-ELEMENT ANALYSIS OF PWB WARPAGE DUE TO THE SOLDER MASKING PROCESS

Researchers have begun to examine the various manufacturing processes that a printed wiring board (PWB) undergoes during its production, suc h as lamination, solder masking, and soldering process to determine th eir impact on board warpage, The goal of this paper is to determine ef fects of the solder masking process on the PWB warpage,:Finite element analysis was used to study the effects of the solder masking process, in particular the curtain coating and curing processes on PWB warpage of four different board designs, These analyses have aided developmen t of general guidelines that should be observed when selecting solder masking material.