FINITE-ELEMENT ANALYSIS OF PWB WARPAGE DUE TO CURED SOLDER MASK - SENSITIVITY ANALYSIS

This paper describes the impact of different types of cured solder mas k and mask thicknesses on printed wiring board (PWB) warpage, Finite e lement analysis (FEA) was used to study the sensitivity of board warpa ge to changes in the mask material properties (different types of sold er mask), and to variations in mask thickness, The sensitivity analysi s of the influence of cured solder mask and variations in mask thickne ss on PWB warpage are the focus of this paper, The study reported in t his paper was carried out with four different board designs, and the r esults are presented here, The results of these analyses have resulted in general guidelines which should be observed when selecting masking materials.