RAPIDLY QUENCHED CU-NI-P ALLOYS

Amorphization behavior of Cu-Ni-P alloys with melting temperatures in the range 920-1020 K, applicable as solders for brazing copper and nic kel alloys, was studied. The amorphous field in this system was shown to be fairly small because of the existence of a large field of solid solutions and the solubility of the metals in copper and nickel phosph ides. The most thermally stable alloys crystallize with the formation of copper phosphide, the alpha-Cu(N,P) solid solution, and nickel phos phide and have melting temperatures close to the ternary eutectic temp erature in the Cu-Ni-P system. The thermal stability of the amorphous alloys may be increased owing to stress relief in response to torsiona l deformation at temperatures of 0.4-0.75T(x).