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Results: 51-66/66
Authors:
CLARK AJ
WHITE AJ
LEANEY PG
WYCHERLEY AJ
Citation: Aj. Clark et al., A QUALITY MODELING SYSTEM FOR PREDICTING THE YIELD OF ASSEMBLY AND TEST PROCESSES IN THE PRINTED-CIRCUIT ASSEMBLY INDUSTRY, JOURNAL OF ELECTRONICS MANUFACTURING, 5(2), 1995, pp. 75-87
Authors:
DEWSBURY M
DALE BG
Citation: M. Dewsbury et Bg. Dale, QUALITY IMPROVEMENT IN A PRINTED-CIRCUIT BOARD MANUFACTURER - A CASE-STUDY EXAMINATION, JOURNAL OF ELECTRONICS MANUFACTURING, 5(2), 1995, pp. 89-97
Authors:
CHUNG CW
SRIHARI K
ADRIANCE JH
WESTBY GR
Citation: Cw. Chung et al., A CLOSED-LOOP SYSTEM FOR THE REALTIME CONTROL OF SOLDER PASTE STENCILPRINTING, JOURNAL OF ELECTRONICS MANUFACTURING, 5(2), 1995, pp. 99-109
Authors:
OGUNJIMI AO
MACGREGOR S
PECHT MG
EVANS JW
Citation: Ao. Ogunjimi et al., THE EFFECT OF MANUFACTURING AND DESIGN PROCESS VARIABILITIES ON THE FATIGUE LIFE OF THE HIGH-DENSITY INTERCONNECT VIAS, JOURNAL OF ELECTRONICS MANUFACTURING, 5(2), 1995, pp. 111-119
Authors:
MORAND P
Citation: P. Morand, PARTNERING WITH CUSTOMERS BY CAPTURING THEIR VOICE, JOURNAL OF ELECTRONICS MANUFACTURING, 5(2), 1995, pp. 121-128
Authors:
GEREN N
Citation: N. Geren, NONCONTACT TEMPERATURE-MEASUREMENT IN SM COMPONENT REWORK, JOURNAL OF ELECTRONICS MANUFACTURING, 5(2), 1995, pp. 129-136
Authors:
ONG NS
Citation: Ns. Ong, A DECISION-SUPPORT TOOL FOR PRINTED-CIRCUIT BOARD ASSEMBLY, JOURNAL OF ELECTRONICS MANUFACTURING, 5(2), 1995, pp. 137-151
Authors:
STAM F
OGRADY P
BARRETT J
Citation: F. Stam et al., CHARACTERIZATION AND RELIABILITY STUDY OF ANISOTROPIC CONDUCTIVE ADHESIVES FOR FINE-PITCH PACKAGE ASSEMBLY, JOURNAL OF ELECTRONICS MANUFACTURING, 5(1), 1995, pp. 1-8
Authors:
WILLIAMS DJ
Citation: Dj. Williams, UNTITLED, JOURNAL OF ELECTRONICS MANUFACTURING, 5(1), 1995, pp. 3-3
Authors:
LI L
MORRIS JE
Citation: L. Li et Je. Morris, STRUCTURE AND SELECTION MODELS FOR ANISOTROPIC CONDUCTIVE ADHESIVE FILMS, JOURNAL OF ELECTRONICS MANUFACTURING, 5(1), 1995, pp. 9-17
Authors:
SAVOLAINEN P
KIVILAHTI J
Citation: P. Savolainen et J. Kivilahti, ELECTRICAL-PROPERTIES OF SOLDER FILLED ANISOTROPICALLY CONDUCTIVE ADHESIVES, JOURNAL OF ELECTRONICS MANUFACTURING, 5(1), 1995, pp. 19-26
Authors:
VANNOORT HM
KLOOS MJH
SCHAFER HEA
Citation: Hm. Vannoort et al., ANISOTROPIC CONDUCTIVE ADHESIVES FOR CHIP ON GLASS AND OTHER FLIP-CHIP APPLICATIONS, JOURNAL OF ELECTRONICS MANUFACTURING, 5(1), 1995, pp. 27-31
Authors:
SHIOZAWA N
ISAKA K
OHTA T
Citation: N. Shiozawa et al., ELECTRIC PROPERTIES OF CONNECTIONS BY ANISOTROPIC CONDUCTIVE FILM, JOURNAL OF ELECTRONICS MANUFACTURING, 5(1), 1995, pp. 33-37
Authors:
PON GKK
LAW HW
Citation: Gkk. Pon et Hw. Law, OPTIMIZATION OF A COPPER PATTERN PLATING PROCESS WITH PLANNED EXPERIMENTATION AND RESPONSE-SURFACE, JOURNAL OF ELECTRONICS MANUFACTURING, 5(1), 1995, pp. 39-47
Authors:
TAN CU
Citation: Cu. Tan, SOLDER WIRE DIE BOND PROCESS CHARACTERIZATION STUDY, JOURNAL OF ELECTRONICS MANUFACTURING, 5(1), 1995, pp. 49-55
Authors:
ALLEN WJJ
CURRAN EP
STEWART JJT
Citation: Wjj. Allen et al., A DESIGN FOR MANUFACTURE KNOWLEDGE-BASED SYSTEM IN PRINTED BOARD ASSEMBLY PRODUCTION FOR NORTHERN-TELECOM (NORTHERN-IRELAND-LTD), JOURNAL OF ELECTRONICS MANUFACTURING, 5(1), 1995, pp. 57-63