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Results:
1-21
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Results: 21
Authors:
Abys, JA
Citation: Ja. Abys, The identification of particulate surface contaminants using SEM/EDS, PLAT SURF F, 88(9), 2001, pp. 43
Authors:
Abys, JA
Citation: Ja. Abys, Analysis of adhesion failures of thermally treated tin-plated copper usingAES, PLAT SURF F, 88(7), 2001, pp. 28-29
Authors:
Fan, C
Xu, C
Abys, JA
Blair, A
Chinchankar, V
Citation: C. Fan et al., Gold wire bonding to nickel palladium plated leadframes, PLAT SURF F, 88(7), 2001, pp. 54-58
Authors:
Abys, JA
Citation: Ja. Abys, Solderability & wirebonding performance of nickel/palladium-plated leadframes, PLAT SURF F, 88(5), 2001, pp. 114-115
Authors:
Abys, JA
Citation: Ja. Abys, The effect of chromium contamination in a tin plating bath, PLAT SURF F, 88(3), 2001, pp. 50-51
Authors:
Abys, JA
Citation: Ja. Abys, Investigating poor wear in cobalt-hardened gold deposits using Raman spectroscopy & atomic absorption spectroscopy, PLAT SURF F, 88(11), 2001, pp. 26-27
Authors:
Abys, JA
Citation: Ja. Abys, Multilayer printed circuit board analysis of interlayer adhesion failure, PLAT SURF F, 88(1), 2001, pp. 64-65
Authors:
Abys, JA
Citation: Ja. Abys, Ion chromatography as a process control tool in semiconductor leadframe manufacturing, PLAT SURF F, 87(9), 2000, pp. 58-59
Authors:
Xu, C
Zhang, Y
Fan, C
Chiu, P
Abys, JA
Citation: C. Xu et al., Surface morphology, appearance & tribology of electrodeposited tin films, PLAT SURF F, 87(9), 2000, pp. 88-92
Authors:
Abys, JA
Citation: Ja. Abys, Palladium plating, PLAT SURF F, 87(8), 2000, pp. 57-58
Authors:
Abys, JA
Citation: Ja. Abys, High-temperature finish for automotive connector applications, PLAT SURF F, 87(7), 2000, pp. 44-45
Authors:
Abys, JA
Citation: Ja. Abys, High force connector for telecommunications: An analysis of wear resistance, PLAT SURF F, 87(5), 2000, pp. 18-19
Authors:
Abys, JA
Citation: Ja. Abys, The effect of carbon content on the solderability/reflowability of tin & tin-lead electrodeposits, PLAT SURF F, 87(3), 2000, pp. 50-51
Authors:
Abys, JA
Citation: Ja. Abys, Optimization of tin plating process for adhesive bonding, PLAT SURF F, 87(11), 2000, pp. 32-33
Authors:
Abys, JA
Citation: Ja. Abys, The effect of base metal impurities on the solderability & wirebonding of semiconductor leadframes, PLAT SURF F, 87(1), 2000, pp. 54-55
Authors:
Zhang, Y
Abys, JA
Citation: Y. Zhang et Ja. Abys, Tin and tin alloys for lead-free solder, ELEC SOC S, 2000, pp. 241-287
Authors:
Abys, JA
Dullaghan, CA
Citation: Ja. Abys et Ca. Dullaghan, Electrodeposition of palladium and palladium alloys, ELEC SOC S, 2000, pp. 483-553
Authors:
Abys, JA
Citation: Ja. Abys, Palladium plating, PLAT SURF F, 86(11), 1999, pp. 57-58
Authors:
Abys, JA
Breck, GF
Straschil, HK
Bogustavsky, I
Holmbom, G
Citation: Ja. Abys et al., The electrodeposition & material properties of palladium-cobalt, PLAT SURF F, 86(1), 1999, pp. 108-115
New methods for coating surfaces - Palladium-cobalt alloy for electrical engineering and electronics
Authors:
Abys, JA
Breck, GF
Straschil, HK
Boguslavsky, I
Holmbom, G
Citation: Ja. Abys et al., New methods for coating surfaces - Palladium-cobalt alloy for electrical engineering and electronics, METALL, 53(11), 1999, pp. 622-625
Authors:
Abys, JA
Kudrak, EJ
Fan, C
Citation: Ja. Abys et al., The materials properties and contact reliability of palladium-cobalt, T I MET FIN, 77, 1999, pp. 164-168
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