Authors:
Gaganidze, E
Schwab, R
Halbritter, J
Heidinger, R
Aidam, R
Schneider, R
Citation: E. Gaganidze et al., Power handling capabilities of Y-Ba-Cu-O wafers and patterned microstrip resonators, IEEE APPL S, 11(1), 2001, pp. 2808-2811
Authors:
Zaitsev, AG
Schneider, R
Aidam, R
Linker, G
Ratzel, F
Reiner, J
Smithey, R
Geerk, J
Citation: Ag. Zaitsev et al., Effect of a Au contact layer on the microwave performance of YBa2Cu3O7-x thin films, IEEE APPL S, 11(1), 2001, pp. 3423-3426
Authors:
Geerk, J
Zaitsev, A
Linker, G
Aidam, R
Schneider, R
Ratzel, F
Fromknecht, R
Scheerer, B
Reiner, H
Gaganidze, E
Schwab, R
Citation: J. Geerk et al., A 3-chamber deposition system for the simultaneous double-sided coating of5-inch wafers, IEEE APPL S, 11(1), 2001, pp. 3856-3858
Authors:
Schwab, R
Gaganidze, E
Halbritter, J
Heidinger, R
Aidam, R
Schneider, R
Citation: R. Schwab et al., YBCO wafer qualification by surface resistance measurements combined with performance studies of microstrip resonators, PHYSICA C, 351(1), 2001, pp. 25-28
Citation: R. Aidam et R. Schneider, Growth and characterization of Pb( Zr,Ti)O-3 thin films and ferroelectric polarization charging of YBa2Cu3O7 thin films, THIN SOL FI, 384(1), 2001, pp. 1-14