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Results: 1-3 |
Results: 3
Low cost bumping by stencil printing: process qualification for 200 mu m pitch
Authors: Kloeser, J Heinricht, K Jung, E Lauter, L Ostmann, A Aschenbrenner, R Reichl, H
Citation: J. Kloeser et al., Low cost bumping by stencil printing: process qualification for 200 mu m pitch, MICROEL REL, 40(3), 2000, pp. 497-505
A new approach for system integrated packaging
Authors: Aschenbrenner, R Ostmann, A Jung, E Landesberger, C Reichl, H
Citation: R. Aschenbrenner et al., A new approach for system integrated packaging, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 41-45
Single chip bumping and reliability for flip chip processes
Authors: Klein, M Oppermann, H Kalicki, R Aschenbrenner, R Reichl, H
Citation: M. Klein et al., Single chip bumping and reliability for flip chip processes, MICROEL REL, 39(9), 1999, pp. 1389-1397
Risultati: 1-3 |