Authors: BANKS DR BURNETTE TE GERKE RD MAMMO E MATTAY S

Citation: Dr. Banks et al., RELIABILITY COMPARISON OF 2 METALLURGIES FOR CERAMIC BALL GRID ARRAY, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(1), 1995, pp. 53-57

Authors: RIES MD BANKS DR WATSON DP HOEBENER KG

Citation: Md. Ries et al., ATTACHMENT OF SOLDER BALL CONNECT (SBC) PACKAGES TO CIRCUIT CARDS, IBM journal of research and development, 37(5), 1993, pp. 597-608