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Results:
1-9
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Results: 9
Authors:
VANDEVELDE B
CHRISTIAENS F
BEYNE E
ROGGEN J
PEETERS J
ALLAERT K
VANDEPITTE D
BERGMANS J
Citation: B. Vandevelde et al., THERMOMECHANICAL MODELS FOR LEADLESS SOLDER INTERCONNECTIONS IN FLIP-CHIP ASSEMBLIES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 177-185
Authors:
SOLIMAN EA
BREBELS S
BEYNE E
DELMOTTE P
VANDENBOSCH G
Citation: Ea. Soliman et al., BRICK-WALL ANTENNA IN MULTILAYER THIN-FILM TECHNOLOGY, Microwave and optical technology letters (Print), 19(5), 1998, pp. 360-365
Authors:
BIJNENS W
DEWOLF I
MANCA J
DHAEN J
WU TD
DOLIESLAEGER M
BEYNE E
KIEBOOMS R
VANDERZANDE D
GELAN J
DECEUNINCK W
DESCHEPPER L
STALS LM
Citation: W. Bijnens et al., ELECTRICAL-FIELD INDUCED AGING OF POLYMER LIGHT-EMITTING-DIODES IN ANOXYGEN-RICH ATMOSPHERE STUDIED BY EMISSION MICROSCOPY, SCANNING ELECTRON-MICROSCOPY AND SECONDARY-ION MASS-SPECTROSCOPY, Synthetic metals, 96(2), 1998, pp. 87-96
Authors:
SOLIMAN EA
BREBELS S
VANDENBOSCH G
BEYNE E
Citation: Ea. Soliman et al., X-BAND BRICK WALL ANTENNA FED BY CPW, Electronics Letters, 34(9), 1998, pp. 836-838
Authors:
TRUZZI C
BEYNE E
RINGOOT E
Citation: C. Truzzi et al., PERFORMANCE ANALYSIS OF MCM SYSTEMS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 20(3), 1997, pp. 334-341
Authors:
MAHMOUD SF
BEYNE E
Citation: Sf. Mahmoud et E. Beyne, INDUCTANCE AND QUALITY-FACTOR EVALUATION OF PLANAR LUMPED INDUCTORS IN A MULTILAYER CONFIGURATION, IEEE transactions on microwave theory and techniques, 45(6), 1997, pp. 918-923
Authors:
CHRISTIAENS F
VANDEVELDE B
BEYNE E
ROGGEN J
Citation: F. Christiaens et al., EVALUATION OF STRUCTURAL DEGRADATION IN PACKAGED SEMICONDUCTOR COMPONENTS USING A TRANSIENT THERMAL CHARACTERIZATION TECHNIQUE, Microelectronics and reliability, 36(11-12), 1996, pp. 1807-1810
Authors:
PEETERS J
BEYNE E
Citation: J. Peeters et E. Beyne, BROAD-BAND MODELING AND TRANSIENT ANALYSIS OF MCM INTERCONNECTIONS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(2), 1994, pp. 153-160
Authors:
VANHECKE B
DESCHEPPER L
DECEUNINCK W
DHAEGER V
DOLIESLAEGERS M
BEYNE E
ROGGEN J
STALS L
Citation: B. Vanhecke et al., ELECTROMIGRATION - INVESTIGATION OF HETEROGENEOUS SYSTEMS, Microelectronics and reliability, 33(8), 1993, pp. 1141-1157
Risultati:
1-9
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