Authors: BLECH IA

Citation: Ia. Blech, DIFFUSIONAL BACK FLOWS DURING ELECTROMIGRATION, Acta materialia, 46(11), 1998, pp. 3717-3723

Authors: FINOT M BLECH IA SURESH S FUJIMOTO H

Citation: M. Finot et al., LARGE-DEFORMATION AND GEOMETRIC INSTABILITY OF SUBSTRATES WITH THIN-FILM DEPOSITS, Journal of applied physics, 81(8), 1997, pp. 3457-3464

Authors: SHEN YL SURESH S BLECH IA

Citation: Yl. Shen et al., STRESSES, CURVATURES, AND SHAPE CHANGES ARISING FROM PATTERNED LINES ON SILICON-WAFERS, Journal of applied physics, 80(3), 1996, pp. 1388-1398

Authors: BLECH IA WOOD P

Citation: Ia. Blech et P. Wood, LINEAR THERMAL-EXPANSION COEFFICIENT AND BIAXIAL ELASTIC-MODULUS OF DIAMOND-LIKE CARBON-FILMS, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 11(3), 1993, pp. 728-729