Authors: CHANG CS OSCILOWSKI A BRACKEN RC

Citation: Cs. Chang et al., FUTURE CHALLENGES IN ELECTRONICS PACKAGING, IEEE circuits and devices magazine, 14(2), 1998, pp. 45-54

Authors: CHANG CS BRACKEN RC OSCILOWSKI A

Citation: Cs. Chang et al., ASSEMBLY AND PACKAGING CHALLENGES, Solid state technology, 41(3), 1998, pp. 90