Authors: Baine, P Choon, KY Gamble, HS Armstrong, BM Mitchell, SJN

Citation: P. Baine et al., Novel materials for thermal via incorporation into SOI structures, J MAT S-M E, 12(4-6), 2001, pp. 215-218

Authors: Gamble, HS Armstrong, BM Baine, P Bain, M McNeill, DW

Citation: Hs. Gamble et al., Silicon-on-insulator substrates with buried tungsten silicide layer, SOL ST ELEC, 45(4), 2001, pp. 551-557