Authors: Baldwin, DF Deshmukh, RD Hau, CS

Citation: Df. Baldwin et al., Gallium alloy interconnects for flip-chip assembly applications, IEEE T COMP, 23(2), 2000, pp. 360-366

Authors: Bhattacharya, SK Gardner, BM Qu, J Baldwin, DF Tummala, RR

Citation: Sk. Bhattacharya et al., Low-cost large area processing using small area substrates - A novel multitiled palletization concept for MCM-D thin film process, IEEE T AD P, 23(4), 2000, pp. 661-671

Authors: Bhattacharya, SK Baldwin, DF

Citation: Sk. Bhattacharya et Df. Baldwin, A low temperature processable ternary gallium alloy for via filling application in microelectronic packaging, J MAT S-M E, 11(9), 2000, pp. 653-656

Authors: Palaniappan, P Baldwin, DF

Citation: P. Palaniappan et Df. Baldwin, In process stress analysis of flip-chip assemblies during underfill cure, MICROEL REL, 40(7), 2000, pp. 1181-1190

Authors: Baldwin, DF Beerensson, JT

Citation: Df. Baldwin et Jt. Beerensson, Thermal management in direct chip attach assemblies, J ELEC PACK, 121(4), 1999, pp. 222-230

Authors: Rodriguez, G Baldwin, DF

Citation: G. Rodriguez et Df. Baldwin, Analysis of solder paste release in fine pitch stencil printing processes, J ELEC PACK, 121(3), 1999, pp. 169-178