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Results:
1-20
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Results: 20
Authors:
Semiatin, SL
Bieler, TR
Citation: Sl. Semiatin et Tr. Bieler, The effect of alpha platelet thickness on plastic flow during hot working of Ti-6Al-4V with a transformed microstructure, ACT MATER, 49(17), 2001, pp. 3565-3573
Authors:
Semiatin, SL
Bieler, TR
Citation: Sl. Semiatin et Tr. Bieler, Effect of texture and slip mode on the anisotropy of plastic flow and flowsoftening during hot working of Ti-6Al-4V, MET MAT T A, 32(7), 2001, pp. 1787-1799
Authors:
Semiatin, SL
Bieler, TR
Citation: Sl. Semiatin et Tr. Bieler, Effect of texture changes on flow softening during hot working of Ti-6Al-4V, MET MAT T A, 32(7), 2001, pp. 1871-1875
Authors:
Semiatin, SL
Brown, JO
Brown, TM
DeLo, DP
Bieler, TR
Beynon, JH
Citation: Sl. Semiatin et al., Strain-path effects during hot working of Ti-6Al-4V with a colony-alpha microstructure, MET MAT T A, 32(6), 2001, pp. 1556-1559
Authors:
Choi, S
Lee, JG
Guo, F
Bieler, TR
Subramanian, KN
Lucas, JP
Citation: S. Choi et al., Creep properties of Sn-Ag solder joints containing intermetallic particles, JOM-J MIN, 53(6), 2001, pp. 22-26
Authors:
Choi, S
Bieler, TR
Subramanian, KN
Lucas, JP
Citation: S. Choi et al., Effects of Pb contamination on the eutectic Sn-Ag solder joint, SOLDER S MT, 13(2), 2001, pp. 26-29
Authors:
Guo, F
Lee, J
Choi, S
Lucas, JP
Bieler, TR
Subramanian, KN
Citation: F. Guo et al., Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles, J ELEC MAT, 30(9), 2001, pp. 1073-1082
Authors:
Jadhav, SG
Bieler, TR
Subramanian, KN
Lucas, JP
Citation: Sg. Jadhav et al., Stress relaxation behavior of composite and eutectic Sn-Ag solder joints, J ELEC MAT, 30(9), 2001, pp. 1197-1205
Authors:
Guo, F
Lee, J
Lucas, JP
Subramanian, KN
Bieler, TR
Citation: F. Guo et al., Creep properties of eutectic Sn-3.5Ag solder joints reinforced with mechanically incorporated Ni particles, J ELEC MAT, 30(9), 2001, pp. 1222-1227
Authors:
Ayres, VM
Farhan, M
Spach, D
Bobbitt, J
Majeed, JA
Wright, BF
Wright, BL
Asmussen, J
Kanatzidis, MG
Bieler, TR
Citation: Vm. Ayres et al., Transitions in morphology observed in nitrogen/methane-hydrogen depositions of polycrystalline diamond films, J APPL PHYS, 89(11), 2001, pp. 6062-6068
Authors:
Choi, S
Lucas, JP
Subramanian, KN
Bieler, TR
Citation: S. Choi et al., Formation and growth of interfacial intermetallic layers in eutectic Sn-Agsolder and its composite solder joints, J MAT S-M E, 11(6), 2000, pp. 497-502
Authors:
Ayres, VM
Bieler, TR
Kanatzidis, MG
Spano, J
Hagopian, S
Balhareth, H
Wright, BF
Farhan, M
Majeed, JA
Spach, D
Wright, BL
Asmussen, J
Citation: Vm. Ayres et al., The effect of nitrogen on competitive growth mechanisms of diamond thin films, DIAM RELAT, 9(3-6), 2000, pp. 236-240
Authors:
McDougall, J
Choi, S
Bieler, TR
Subramanian, KN
Lucas, JP
Citation: J. Mcdougall et al., Quantification of creep strain distribution in small crept lead-free in-situ composite and non composite solder joints, MAT SCI E A, 285(1-2), 2000, pp. 25-34
Authors:
Choi, S
Subramanian, KN
Lucas, JP
Bieler, TR
Citation: S. Choi et al., Thermomechanical fatigue behavior of Sn-Ag solder joints, J ELEC MAT, 29(10), 2000, pp. 1249-1257
Authors:
Miller, RM
Bieler, TR
Semiatin, SL
Citation: Rm. Miller et al., Flow softening during hot working of Ti-6Al-4V with a lamellar colony microstructure, SCR MATER, 40(12), 1999, pp. 1387-1393
Authors:
Semiatin, SL
Bieler, TR
Citation: Sl. Semiatin et Tr. Bieler, Microstructural evolution during the hot working of superalloys, JOM-J MIN, 51(1), 1999, pp. 13-13
Authors:
Subramanian, KN
Bieler, TR
Lucas, JP
Citation: Kn. Subramanian et al., Microstructural engineering of solders, J ELEC MAT, 28(11), 1999, pp. 1176-1183
Authors:
Sigelko, J
Choi, S
Subramanian, KN
Lucas, JP
Bieler, TR
Citation: J. Sigelko et al., Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5reinforcements, J ELEC MAT, 28(11), 1999, pp. 1184-1188
Authors:
Choi, S
Bieler, TR
Lucas, JP
Subramanian, KN
Citation: S. Choi et al., Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging, J ELEC MAT, 28(11), 1999, pp. 1209-1215
Authors:
Lucas, JP
Guo, F
McDougall, J
Bieler, TR
Subramanian, KN
Park, JK
Citation: Jp. Lucas et al., Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique, J ELEC MAT, 28(11), 1999, pp. 1270-1275
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