Authors: Smee, SA Gaitan, M Novotny, DB Joshi, Y Blackburn, DL

Citation: Sa. Smee et al., IC test structures for multilayer interconnect stress determination, IEEE ELEC D, 21(1), 2000, pp. 12-14

Authors: Blackburn, DL Courtois, B

Citation: Dl. Blackburn et B. Courtois, Thermal investigations of ICs and microstructures (THERMINIC) - Foreword, IEEE T COMP, 22(2), 1999, pp. 229-230

Authors: Adams, VH Joshi, Y Blackburn, DL

Citation: Vh. Adams et al., Three-dimensional study of combined conduction, radiation, and natural convection from discrete heat sources in a horizontal narrow-aspect-ratio enclosure, J HEAT TRAN, 121(4), 1999, pp. 992-1001