Authors: Gan, T Tugbawa, T Lee, B Boning, DS Jang, S

Citation: T. Gan et al., Modeling of reverse tone etchback shallow trench isolation chemical mechanical polishing, J ELCHEM SO, 148(3), 2001, pp. G159-G165

Authors: Smith, TH Boning, DS Moyne, J

Citation: Th. Smith et al., Advanced process control in the semiconductor industry, RUN-TO-RUN CONTROL IN SEMICONDUCTOR MANUFACTURING, 2001, pp. 15-44

Authors: Ning, Z Moyne, JR Smith, TH Boning, DS Del Castillo, E Yeh, JY Hurwitz, AM

Citation: Z. Ning et al., A comparative analysis of run-to-run control algorithms in the semiconductor manufacturing industry, RUN-TO-RUN CONTROL IN SEMICONDUCTOR MANUFACTURING, 2001, pp. 101-111

Authors: White, DA Goodlin, BE Gower, AE Boning, DS Chen, H Sawin, HH Dalton, TJ

Citation: Da. White et al., Low open-area endpoint detection using a PCA-based T-2 statistic and Q statistic on optical emission spectroscopy measurements, IEEE SEMIC, 13(2), 2000, pp. 193-207

Authors: Smith, TH Goodlin, BE Boning, DS Sawin, HH

Citation: Th. Smith et al., A statistical analysis of single and multiple response surface modeling, IEEE SEMIC, 12(4), 1999, pp. 419-430

Authors: Smith, TH Fang, SJ Stefani, JA Shinn, GB Boning, DS Butler, SW

Citation: Th. Smith et al., On-line patterned wafer thickness control of chemical-mechanical polishing, J VAC SCI A, 17(4), 1999, pp. 1384-1390