Authors: Chiang, KN Yuan, CA

Citation: Kn. Chiang et Ca. Yuan, An overview of solder bump shape prediction algorithms with validations, IEEE T AD P, 24(2), 2001, pp. 158-162

Authors: Chiang, KN Liu, CM

Citation: Kn. Chiang et Cm. Liu, A comparison of thermal stress/strain behavior of elliptical/round solder pads, J ELEC PACK, 123(2), 2001, pp. 127-131

Authors: Cheng, HC Chiang, KN Chen, CK Lin, JC

Citation: Hc. Cheng et al., A study of factors affecting solder joint fatigue life of thermally enhanced ball grid array assemblies, J CHIN I EN, 24(4), 2001, pp. 439-451

Authors: Lin, JC Chiang, KN

Citation: Jc. Lin et Kn. Chiang, Thermal/mechanical analysis of novel Ceramic-TSOP using nonlinear finite element method, J CHIN I EN, 24(4), 2001, pp. 453-462

Authors: Chiang, KN Lin, YT Cheng, HC

Citation: Kn. Chiang et al., On enhancing eutectic solder joint reliability using a second-reflow-process approach, IEEE T AD P, 23(1), 2000, pp. 9-14

Authors: Chiang, KN Chang, CW Lin, JD

Citation: Kn. Chiang et al., Analysis of ACA/ACF package using equivalent spring method, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 110-116