Citation: Xc. Luo et Ddl. Chung, Degradation of mechanically fastened stainless steel joint during repeatedfastening and unfastening, ADV ENG MAT, 3(1-2), 2001, pp. 62-65
Citation: Xc. Luo et al., Thermal stability of thermal interface pastes, evaluated by thermal contact conductance measurement, J ELEC PACK, 123(3), 2001, pp. 309-311
Citation: Ys. Xu et al., Sodium silicate based thermal interface material for high thermal contact conductances (vol 122, pg 128, 2000), J ELEC PACK, 123(2), 2001, pp. 159-159
Citation: Z. Liu et Ddl. Chung, Development of glass-free metal electrically conductive thick films (vol 123, pg 64, 2001), J ELEC PACK, 123(2), 2001, pp. 159-159
Citation: Wh. Fu et Ddl. Chung, Vibration reduction ability of polymers, particularly polymethylmethacrylate and polytetrafluoroethylene, POLYM POL C, 9(6), 2001, pp. 423-426
Citation: Sk. Wang et Ddl. Chung, Thermal fatigue in carbon fibre polymer-matrix composites, monitored in real time by electrical resistance measurements, POLYM POL C, 9(2), 2001, pp. 135-140
Citation: Xc. Luo et Ddl. Chung, Tribology of graphite and concrete, studied by contact electrical resistance measurement during cyclic compression, J TRIBOL, 123(4), 2001, pp. 682-685
Citation: Sk. Wang et Ddl. Chung, Consolidation of carbon fiber laminae during polymer-matrix composite fabrication, studied by electrical resistance measurement, POLYM COMP, 22(1), 2001, pp. 42-46
Citation: Z. Mei et Ddl. Chung, Thermal history of carbon-fiber polymer-matrix composite, evaluated by electrical resistance measurement, THERMOC ACT, 369(1-2), 2001, pp. 87-93
Citation: Zr. Liu et Ddl. Chung, Calorimetric evaluation of phase change materials for use as thermal interface materials, THERMOC ACT, 366(2), 2001, pp. 135-147