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Results:
1-17
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Results: 17
Authors:
Baklanov, MR
Shamiryan, DG
Tokei, Z
Beyer, GP
Conard, T
Vanhaelemeersch, S
Maex, K
Citation: Mr. Baklanov et al., Characterization of Cu surface cleaning by hydrogen plasma, J VAC SCI B, 19(4), 2001, pp. 1201-1211
Authors:
Claes, M
De Gendt, S
Kenens, C
Conard, T
Bender, H
Storm, W
Bauer, T
Mertens, P
Citation: M. Claes et al., Controlled deposition of organic contamination and removal with ozone-based cleanings, J ELCHEM SO, 148(3), 2001, pp. G118-G125
Authors:
Vos, R
Lux, M
Xu, K
Fyen, W
Kenens, C
Conard, T
Mertens, P
Heyns, M
Hatcher, Z
Hoffman, M
Citation: R. Vos et al., Removal of submicrometer particles from silicon wafer surfaces using HF-based cleaning mixtures, J ELCHEM SO, 148(12), 2001, pp. G683-G691
Authors:
Stalmans, L
Poortmans, J
Bender, H
Jin, S
Conard, T
Nijs, J
Debarge, L
Slaoui, A
Citation: L. Stalmans et al., Effects of low-thermal-budget treatments on the porous Si material properties, J POROUS MA, 7(1-3), 2000, pp. 67-71
Authors:
Baklanov, MR
Van Hove, M
Mannaert, G
Vanhaelemeersch, S
Bender, H
Conard, T
Maex, K
Citation: Mr. Baklanov et al., Low temperature oxidation and selective etching of chemical vapor deposition a-SiC : H films, J VAC SCI B, 18(3), 2000, pp. 1281-1287
Authors:
Brijs, B
Deleu, J
Conard, T
De Witte, H
Vandervorst, W
Nakajima, K
Kimura, K
Genchev, I
Bergmaier, A
Goergens, L
Neumaier, P
Dollinger, G
Dobeli, M
Citation: B. Brijs et al., Characterization of ultra thin oxynitrides: A general approach, NUCL INST B, 161, 2000, pp. 429-434
Authors:
De Witte, H
Conard, T
Vandervorst, W
Gijbels, R
Citation: H. De Witte et al., SIMS analysis of oxynitrides: evidence for nitrogen diffusion induced by oxygen flooding, SURF INT AN, 29(11), 2000, pp. 761-765
Authors:
De Witte, H
De Gendt, S
Douglas, M
Conard, T
Kenis, K
Mertens, PW
Vandervorst, W
Gijbels, R
Citation: H. De Witte et al., Evaluation of time-of-flight secondary ion mass spectrometry for metal contamination monitoring on Si wafer surfaces, J ELCHEM SO, 147(5), 2000, pp. 1915-1919
Authors:
Li, H
Bender, H
Conard, T
Maex, K
Gutakovskii, A
Van Landuyt, J
Froyen, L
Citation: H. Li et al., Interaction of a Ti-capped Co thin film with Si3N4, APPL PHYS L, 77(26), 2000, pp. 4307-4309
Authors:
Donaton, RA
Jin, S
Bender, H
Conard, T
De Wolf, I
Maex, K
Vantomme, A
Langouche, G
Citation: Ra. Donaton et al., New technique for forming continuous, smooth, and uniform ultrathin (3 nm)PtSi layers, EL SOLID ST, 2(4), 1999, pp. 195-197
Authors:
Stalmans, L
Poortmans, J
Bender, H
Conard, T
Jin, S
Nijs, J
Mertens, R
Strehlke, S
Levy-Clement, C
Debarge, L
Slaoui, A
Citation: L. Stalmans et al., Low-thermal-budget treatments of porous silicon surface layers on crystalline Si solar cells: A way to go for improved surface passivation?, SOL EN MAT, 58(3), 1999, pp. 237-252
Authors:
Kondoh, E
Conard, T
Brijs, B
Jin, S
Bender, H
de Potter, M
Maex, K
Citation: E. Kondoh et al., A chemical role of refractory metal caps in Co silicidation: Evidence of SiO2 reduction by Ti cap, J MATER RES, 14(11), 1999, pp. 4402-4408
Authors:
Conard, T
Kondoh, E
De Witte, H
Maex, K
Vandervorst, W
Citation: T. Conard et al., X-ray photoelectron spectroscopy and time-of-flight secondary ion mass spectrometry study of the role of Ti and TiN caps on the cobalt/SiO2 interface, J VAC SCI A, 17(4), 1999, pp. 1244-1249
Authors:
Conard, T
De Witte, H
Loo, R
Verheyen, P
Vandervorst, W
Caymax, M
Gijbels, R
Citation: T. Conard et al., XPS and TOFSIMS studies of shallow Si/Si1-xGex/Si layers, THIN SOL FI, 344, 1999, pp. 583-586
Authors:
Kim, YB
Baklanov, MR
Conard, T
de Potter, M
Vanhaeleemeersch, S
Citation: Yb. Kim et al., Characterization of the post dry-etch cleaning of silicon for Ti-self-aligned silicide technology, J ELCHEM SO, 146(4), 1999, pp. 1549-1556
Authors:
Proost, J
Li, H
Conard, T
Boullart, W
Maex, K
Citation: J. Proost et al., Chemical and electrical characterization of the interaction of BCl3/Cl-2 etching and CF4/H2O stripping plasmas with aluminum surfaces, J ELCHEM SO, 146(11), 1999, pp. 4230-4235
Authors:
Li, H
Baklanov, M
Boullart, W
Conard, T
Brijs, B
Maex, K
Froyen, L
Citation: H. Li et al., Analyses of post metal etch cleaning in downstream H2O-based plasma followed by a wet chemistry, J ELCHEM SO, 146(10), 1999, pp. 3843-3851
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