Authors:
KHANNA PK
BHATNAGAR SK
DALKE G
BRUNNER D
GUST W
Citation: Pk. Khanna et al., DEVELOPMENT OF THERMALLY STABLE NI-AG INTERCONNECTIONS FOR APPLICATION TO RESISTIVE FILMS, Materials science & engineering. B, Solid-state materials for advanced technology, 33(2-3), 1995, pp. 6-9
Citation: F. Bartels et al., INTERMETALLIC PHASE-FORMATION IN THIN SOLID-LIQUID DIFFUSION COUPLES, Journal of electronic materials, 23(8), 1994, pp. 787-790