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Authors: WESTERHEIM AC LABUN AH DUBASH JH ARNOLD JC SAWIN HH YUWANG V

Citation: Ac. Westerheim et al., SUBSTRATE BIAS EFFECTS IN HIGH-ASPECT-RATIO SIO2 CONTACT ETCHING USING AN INDUCTIVELY-COUPLED PLASMA REACTOR, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 13(3), 1995, pp. 853-858