Authors:
Pennetta, C
Reggiani, L
Treffan, G
Fantini, F
Scorzoni, A
De Munari, I
Citation: C. Pennetta et al., Investigation of the role of compositional effects on electromigration damage of metallic interconnects, COMP MAT SC, 22(1-2), 2001, pp. 13-18
Authors:
Braghieri, A
De Munari, I
Impronta, M
Scorzoni, A
Citation: A. Braghieri et al., Evaluation of the thermal resistance of Al-Cu electromigration test structures, MICROEL REL, 40(8-10), 2000, pp. 1317-1322
Authors:
Scorzoni, A
Impronta, M
De Munari, I
Fantini, F
Citation: A. Scorzoni et al., A proposal for a standard procedure for moderately accelerated electromigration tests on metal lines, MICROEL REL, 39(5), 1999, pp. 615-626
Authors:
Kelaidis, N
Scorzoni, A
Impronta, M
De Munari, I
Citation: N. Kelaidis et al., A study of the thermal behavior of different test patterns used in differential high resolution electromigration measurements, MICROEL REL, 39(5), 1999, pp. 627-634