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Results: 1-6 |
Results: 6

Authors: Pennetta, C Reggiani, L Treffan, G Fantini, F Scorzoni, A De Munari, I
Citation: C. Pennetta et al., Investigation of the role of compositional effects on electromigration damage of metallic interconnects, COMP MAT SC, 22(1-2), 2001, pp. 13-18

Authors: Pennetta, C Reggiani, L Trefan, G Fantini, F Scorzoni, A De Munari, I
Citation: C. Pennetta et al., A percolative approach to electromigration in metallic lines, J PHYS D, 34(9), 2001, pp. 1421-1429

Authors: Braghieri, A De Munari, I Impronta, M Scorzoni, A
Citation: A. Braghieri et al., Evaluation of the thermal resistance of Al-Cu electromigration test structures, MICROEL REL, 40(8-10), 2000, pp. 1317-1322

Authors: Scorzoni, A Impronta, M De Munari, I Fantini, F
Citation: A. Scorzoni et al., A proposal for a standard procedure for moderately accelerated electromigration tests on metal lines, MICROEL REL, 39(5), 1999, pp. 615-626

Authors: Kelaidis, N Scorzoni, A Impronta, M De Munari, I
Citation: N. Kelaidis et al., A study of the thermal behavior of different test patterns used in differential high resolution electromigration measurements, MICROEL REL, 39(5), 1999, pp. 627-634

Authors: Scorzoni, A De Munari, I Impronta, M Kelaidis, N
Citation: A. Scorzoni et al., Early electromigration effects and early resistance changes, MICROEL REL, 39(11), 1999, pp. 1647-1656
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