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Results: 1-6 |
Results: 6

Authors: Kim, DK Nix, WD Vinci, RP Deal, MD Plummer, JD
Citation: Dk. Kim et al., Study of the effect of grain boundary migration on hillock formation in Althin films, J APPL PHYS, 90(2), 2001, pp. 781-788

Authors: Tringe, JW Deal, MD Plummer, JD
Citation: Jw. Tringe et al., Hydrogen passivation in plasma-etched polycrystalline silicon resistors, EL SOLID ST, 3(11), 2000, pp. 517-519

Authors: Tringe, JW Deal, MD Plummer, JD
Citation: Jw. Tringe et al., A diffraction-based transmission electron microscope technique for measuring average grain size, EL SOLID ST, 3(11), 2000, pp. 520-523

Authors: Kim, D Nix, WD Deal, MD Plummer, JD
Citation: D. Kim et al., Creep-controlled diffusional hillock formation in blanket aluminum thin films as a mechanism of stress relaxation, J MATER RES, 15(8), 2000, pp. 1709-1718

Authors: Kim, D Heiland, B Nix, WD Arzt, E Deal, MD Plummer, JD
Citation: D. Kim et al., Microstructure of thermal hillocks on blanket Al thin films, THIN SOL FI, 371(1-2), 2000, pp. 278-282

Authors: Tringe, JW Deal, MD Plummer, JD
Citation: Jw. Tringe et al., Transparent probe test structure for electrical and physical characterization of defects in thin films, J ELCHEM SO, 147(12), 2000, pp. 4633-4638
Risultati: 1-6 |