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Results: 1-14 |
Results: 14
Estimates of differential sputtering yields for deposition applications
Authors: Stepanova, M Dew, SK
Citation: M. Stepanova et Sk. Dew, Estimates of differential sputtering yields for deposition applications, J VAC SCI A, 19(6), 2001, pp. 2805-2816
Efficient modeling of thin film deposition for low sticking using a three-dimensional microstructural simulator
Authors: Smy, T Dew, SK Joshi, RV
Citation: T. Smy et al., Efficient modeling of thin film deposition for low sticking using a three-dimensional microstructural simulator, J VAC SCI A, 19(1), 2001, pp. 251-261
A 3-D thermal simulation tool for integrated devices - Atar
Authors: Smy, T Walkey, D Dew, SK
Citation: T. Smy et al., A 3-D thermal simulation tool for integrated devices - Atar, IEEE COMP A, 20(1), 2001, pp. 105-115
Transient 3D heat flow analysis for integrated circuit devices using the transmission line matrix method on a quad tree mesh
Authors: Smy, T Walkey, D Dew, SK
Citation: T. Smy et al., Transient 3D heat flow analysis for integrated circuit devices using the transmission line matrix method on a quad tree mesh, SOL ST ELEC, 45(7), 2001, pp. 1137-1148
Three-dimensional simulation of film microstructure produced by glancing angle deposition
Authors: Smy, T Vick, D Brett, MJ Dew, SK Wu, AT Sit, JC Harris, KD
Citation: T. Smy et al., Three-dimensional simulation of film microstructure produced by glancing angle deposition, J VAC SCI A, 18(5), 2000, pp. 2507-2512
Sheath structure of an electronegative plasma with cold positive ions
Authors: Li, M Vyvoda, MA Dew, SK Brett, MJ
Citation: M. Li et al., Sheath structure of an electronegative plasma with cold positive ions, IEEE PLAS S, 28(1), 2000, pp. 248-252
Integrating system and feature scale models to study copper reflow
Authors: Friedrich, LJ Dew, SK Brett, MJ Smy, T
Citation: Lj. Friedrich et al., Integrating system and feature scale models to study copper reflow, J VAC SCI B, 17(1), 1999, pp. 186-193
A simulation study of copper reflow characteristics in vias
Authors: Friedrich, LJ Dew, SK Brett, MJ Smy, T
Citation: Lj. Friedrich et al., A simulation study of copper reflow characteristics in vias, IEEE SEMIC, 12(3), 1999, pp. 353-365
Self-shadowing and surface diffusion effects in obliquely deposited thin films (vol 339, pg 88, 1999)
Authors: Vick, D Friedrich, LJ Dew, SK Brett, MJ Robbie, K Seto, M Smy, T
Citation: D. Vick et al., Self-shadowing and surface diffusion effects in obliquely deposited thin films (vol 339, pg 88, 1999), THIN SOL FI, 349(1-2), 1999, pp. 303-303
Self-shadowing and surface diffusion effects in obliquely deposited thin films
Authors: Vick, D Friedrich, LJ Dew, SK Brett, MJ Robbie, K Seto, M Smy, T
Citation: D. Vick et al., Self-shadowing and surface diffusion effects in obliquely deposited thin films, THIN SOL FI, 339(1-2), 1999, pp. 88-94
Effects of electron distribution functions on the floating potential of particles in the plasma: thin plasma sheaths
Authors: Li, M Dew, SK Brett, MJ
Citation: M. Li et al., Effects of electron distribution functions on the floating potential of particles in the plasma: thin plasma sheaths, J PHYS D, 32(16), 1999, pp. 2056-2059
Direct error estimation based on the potential drop in TLM diffusion modelling
Authors: Gui, X Haslett, JW Dew, SK Brett, MJ
Citation: X. Gui et al., Direct error estimation based on the potential drop in TLM diffusion modelling, INT J N MOD, 11(5), 1998, pp. 255-257
Use of a dynamic network for the TLM solution of diffusion problems
Authors: Dew, SK Gui, X
Citation: Sk. Dew et X. Gui, Use of a dynamic network for the TLM solution of diffusion problems, INT J N MOD, 11(5), 1998, pp. 259-271
An analysis of the role of high energy neutral bombardment in longthrow/collimated sputtering of refractory metal barrier layers
Authors: Smy, T Joshi, RV Tait, N Dew, SK Brett, MJ
Citation: T. Smy et al., An analysis of the role of high energy neutral bombardment in longthrow/collimated sputtering of refractory metal barrier layers, J APPL PHYS, 84(9), 1998, pp. 5315-5325
Risultati: 1-14 |