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Results: 1-25 | 26-40 |
Results: 26-40/40
HIGH-RATE DIRECTIONAL DEEP DRY-ETCHING FOR BULK SILICON MICROMACHINING
Authors: ESASHI M TAKANAMI M WAKABAYASHI Y MINAMI K
Citation: M. Esashi et al., HIGH-RATE DIRECTIONAL DEEP DRY-ETCHING FOR BULK SILICON MICROMACHINING, Journal of micromechanics and microengineering, 5(1), 1995, pp. 5-10
OPTICAL IN-SITU MONITORING OF SILICON DIAPHRAGM THICKNESS DURING WET ETCHING
Authors: TOSAKA H MINAMI K ESASHI M
Citation: H. Tosaka et al., OPTICAL IN-SITU MONITORING OF SILICON DIAPHRAGM THICKNESS DURING WET ETCHING, Journal of micromechanics and microengineering, 5(1), 1995, pp. 41-46
DESIGN OF THE ELECTROSTATIC LINEAR MICROACTUATOR BASED ON THE INCHWORM MOTION
Authors: LEE SK ESASHI M
Citation: Sk. Lee et M. Esashi, DESIGN OF THE ELECTROSTATIC LINEAR MICROACTUATOR BASED ON THE INCHWORM MOTION, Mechatronics, 5(8), 1995, pp. 963-972
AN ELECTROSTATIC SERVO-TYPE 3-AXIS SILICON ACCELEROMETER
Authors: JONO K MINAMI K ESASHI M
Citation: K. Jono et al., AN ELECTROSTATIC SERVO-TYPE 3-AXIS SILICON ACCELEROMETER, Measurement science & technology, 6(1), 1995, pp. 11-15
TEMPERATURE COMPENSATED PIEZORESISTER FABRICATED BY HIGH-ENERGY ION-IMPLANTATION
Authors: NISHIMOTO T SHOJI S MINAMI K ESASHI M
Citation: T. Nishimoto et al., TEMPERATURE COMPENSATED PIEZORESISTER FABRICATED BY HIGH-ENERGY ION-IMPLANTATION, IEICE transactions on electronics, E78C(2), 1995, pp. 152-156
MICROFLOW DEVICES AND SYSTEMS
Authors: SHOJI S ESASHI M
Citation: S. Shoji et M. Esashi, MICROFLOW DEVICES AND SYSTEMS, Journal of micromechanics and microengineering, 4(4), 1994, pp. 157-171
FABRICATION AND PACKAGING OF A RESONANT INFRARED-SENSOR INTEGRATED INSILICON
Authors: CABUZ C SHOJI S FUKATSU K CABUZ E MINAMI K ESASHI M
Citation: C. Cabuz et al., FABRICATION AND PACKAGING OF A RESONANT INFRARED-SENSOR INTEGRATED INSILICON, Sensors and actuators. A, Physical, 43(1-3), 1994, pp. 92-99
VACUUM PACKAGING FOR MICROSENSORS BY GLASS SILICON ANODIC BONDING
Authors: HENMI H SHOJI S SHOJI Y YOSHIMI K ESASHI M
Citation: H. Henmi et al., VACUUM PACKAGING FOR MICROSENSORS BY GLASS SILICON ANODIC BONDING, Sensors and actuators. A, Physical, 43(1-3), 1994, pp. 243-248
BURIED PIEZORESISTIVE SENSORS BY MEANS OF MEV ION-IMPLANTATION
Authors: NISHIMOTO T SHOJI S ESASHI M
Citation: T. Nishimoto et al., BURIED PIEZORESISTIVE SENSORS BY MEANS OF MEV ION-IMPLANTATION, Sensors and actuators. A, Physical, 43(1-3), 1994, pp. 249-253
LASER PROJECTION CVD USING THE LOW-TEMPERATURE CONDENSATION METHOD
Authors: TAKASHIMA K MINAMI K ESASHI M NISHIZAWA J
Citation: K. Takashima et al., LASER PROJECTION CVD USING THE LOW-TEMPERATURE CONDENSATION METHOD, Applied surface science, 80, 1994, pp. 366-374
SILICON MICROMACHINED 2-DIMENSIONAL GALVANO OPTICAL SCANNER
Authors: ASADA N MATSUKI H MINAMI K ESASHI M
Citation: N. Asada et al., SILICON MICROMACHINED 2-DIMENSIONAL GALVANO OPTICAL SCANNER, IEEE transactions on magnetics, 30(6), 1994, pp. 4647-4649
HIGH-RATE DEPOSITION OF SILICON DIOXIDE MEMBRANE BY EXCIMER-LASER ENHANCED PROJECTION CHEMICAL-VAPOR-DEPOSITION FROM ORGANIC-COMPOUNDS AT LOW-TEMPERATURE
Authors: TOMOURA S TAKASHIMA K MINAMI K ESASHI M NISHIZAWA J
Citation: S. Tomoura et al., HIGH-RATE DEPOSITION OF SILICON DIOXIDE MEMBRANE BY EXCIMER-LASER ENHANCED PROJECTION CHEMICAL-VAPOR-DEPOSITION FROM ORGANIC-COMPOUNDS AT LOW-TEMPERATURE, JPN J A P 1, 32(6B), 1993, pp. 3109-3112
INTEGRATED SILICON CAPACITIVE ACCELEROMETER WITH PLL SERVO TECHNIQUE
Authors: MATSUMOTO Y ESASHI M
Citation: Y. Matsumoto et M. Esashi, INTEGRATED SILICON CAPACITIVE ACCELEROMETER WITH PLL SERVO TECHNIQUE, Sensors and actuators. A, Physical, 39(3), 1993, pp. 209-217
MICROFABRICATION AND MICROSENSORS
Authors: SHOJI S ESASHI M
Citation: S. Shoji et M. Esashi, MICROFABRICATION AND MICROSENSORS, Applied biochemistry and biotechnology, 41(1-2), 1993, pp. 21-34
SILICON MICROMACHINING AND MICROMACHINES
Authors: ESASHI M
Citation: M. Esashi, SILICON MICROMACHINING AND MICROMACHINES, Wear, 168(1-2), 1993, pp. 181-187
Risultati: 1-25 | 26-40 |