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Citation: J. Evans et Jy. Evans, PACKAGING FACTORS AFFECTING THE FATIGUE LIFE OF POWER TRANSISTOR DIE BONDS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 459-468

Authors: EVANS JW EVANS JY LALL P CORNFORD SL

Citation: Jw. Evans et al., THERMOMECHANICAL FAILURES IN MICROELECTRONIC INTERCONNECTS, Microelectronics and reliability, 38(4), 1998, pp. 523-529

Authors: EVANS JW EVANS JY YU BK

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Authors: EVANS JW EVANS JY

Citation: Jw. Evans et Jy. Evans, RELIABILITY ASSESSMENT FOR DEVELOPMENT OF MICROTECHNOLOGIES, Microsystem technologies, 3(4), 1997, pp. 145-154