Authors: Zschech, E Engelmann, HJ Saage, H de Robillard, Q Stegmann, H

Citation: E. Zschech et al., Characterization of layer stacks in microelectronic products: Challenges to sample preparation and TEM analysis, PRAKT METAL, 38(8), 2001, pp. 442-453

Authors: Engelmann, HJ Saage, H Zschech, E

Citation: Hj. Engelmann et al., Application of analytical TEM for failure analysis of semiconductor devicestructures, MICROEL REL, 40(8-10), 2000, pp. 1747-1751

Authors: Hietschold, M Muller, F Muller, AD Engelmann, HJ Zschech, E

Citation: M. Hietschold et al., Investigations of local electrical surface characteristics by dynamical scanning force microscopy, FRESEN J AN, 365(1-3), 1999, pp. 96-98