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Results: 1-12 |
Results: 12
Development of micromechanical and optical devices incorporating depositedPZT films
Authors: Wright, RV Patel, A Pealat, M Nonninger, R Diels, R Enoksson, P Fox, C Netter, P
Citation: Rv. Wright et al., Development of micromechanical and optical devices incorporating depositedPZT films, INTEGR FERR, 33(1-4), 2001, pp. 209-220
Low-temperature wafer-level transfer bonding
Authors: Niklaus, F Enoksson, P Griss, P Kalvesten, E Stemme, G
Citation: F. Niklaus et al., Low-temperature wafer-level transfer bonding, J MICROEL S, 10(4), 2001, pp. 525-531
Micromachined electrodes for biopotential measurements
Authors: Griss, P Enoksson, P Tolvanen-Laakso, HK Merilainen, P Ollmar, S Stemme, G
Citation: P. Griss et al., Micromachined electrodes for biopotential measurements, J MICROEL S, 10(1), 2001, pp. 10-16
Low-temperature full wafer adhesive bonding
Authors: Niklaus, F Enoksson, P Kalvesten, E Stemme, G
Citation: F. Niklaus et al., Low-temperature full wafer adhesive bonding, J MICROM M, 11(2), 2001, pp. 100-107
A valve-less diffuser micropump for microfluidic analytical systems
Authors: Andersson, H van der Wijngaart, W Nilsson, P Enoksson, P Stemme, G
Citation: H. Andersson et al., A valve-less diffuser micropump for microfluidic analytical systems, SENS ACTU-B, 72(3), 2001, pp. 259-265
Highly sensitive triaxial silicon accelerometer with integrated PZT thin film detectors
Authors: Kunz, K Enoksson, P Stemme, G
Citation: K. Kunz et al., Highly sensitive triaxial silicon accelerometer with integrated PZT thin film detectors, SENS ACTU-A, 92(1-3), 2001, pp. 156-160
Low temperature full wafer adhesive bonding of structured wafers
Authors: Niklaus, F Andersson, H Enoksson, P Stemme, G
Citation: F. Niklaus et al., Low temperature full wafer adhesive bonding of structured wafers, SENS ACTU-A, 92(1-3), 2001, pp. 235-241
A low-pressure encapsulated deep reactive ion etched resonant pressure sensor electrically excited and detected using 'burst' technology
Authors: Melin, J Enoksson, P Corman, T Stemme, G
Citation: J. Melin et al., A low-pressure encapsulated deep reactive ion etched resonant pressure sensor electrically excited and detected using 'burst' technology, J MICROM M, 10(2), 2000, pp. 209-217
A low-pressure encapsulated resonant fluid density sensor with feedback control electronics
Authors: Corman, T Enoksson, P Noren, K Stemme, G
Citation: T. Corman et al., A low-pressure encapsulated resonant fluid density sensor with feedback control electronics, MEAS SCI T, 11(3), 2000, pp. 205-211
Micromachined flow-through filter-chamber for chemical reactions on beads
Authors: Andersson, H van der Wijngaart, W Enoksson, P Stemme, G
Citation: H. Andersson et al., Micromachined flow-through filter-chamber for chemical reactions on beads, SENS ACTU-B, 67(1-2), 2000, pp. 203-208
"Burst" technology with feedback-loop control for capacitive detection andelectrostatic excitation of resonant silicon sensors
Authors: Corman, T Noren, K Enoksson, P Melin, J Stemme, G
Citation: T. Corman et al., "Burst" technology with feedback-loop control for capacitive detection andelectrostatic excitation of resonant silicon sensors, IEEE DEVICE, 47(11), 2000, pp. 2228-2235
Dynamic simulation model for a vibrating fluid density sensor
Authors: Veijola, T Corman, T Enoksson, P Stemme, G
Citation: T. Veijola et al., Dynamic simulation model for a vibrating fluid density sensor, SENS ACTU-A, 76(1-3), 1999, pp. 213-224
Risultati: 1-12 |