Authors: FILIPPI RG LEVINE EN RODBELL KP

Citation: Rg. Filippi et al., ELECTROMIGRATION BEHAVIOR OF HOT-SPUTTERED AL(CU) VERSUS CHEMICAL-VAPOR-DEPOSITION W VIAS, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 15(3), 1997, pp. 750-756

Authors: DOMENICUCCI AG FILIPPI RG CHOI KW HU CK RODBELL KP

Citation: Ag. Domenicucci et al., EFFECT OF COPPER ON THE MICROSTRUCTURE AND ELECTROMIGRATION LIFETIME OF TI-ALCU-TI FINE LINES IN THE PRESENCE OF TUNGSTEN DIFFUSION-BARRIERS, Journal of applied physics, 80(9), 1996, pp. 4952-4959

Authors: FILIPPI RG WACHNIK RA AOCHI H LLOYD JR KORHONEN MA

Citation: Rg. Filippi et al., THE EFFECT OF CURRENT-DENSITY AND STRIPE LENGTH ON RESISTANCE SATURATION DURING ELECTROMIGRATION TESTING, Applied physics letters, 69(16), 1996, pp. 2350-2352

Authors: FILIPPI RG BIERY GA WACHNIK RA

Citation: Rg. Filippi et al., THE ELECTROMIGRATION SHORT-LENGTH EFFECT IN TI-ALCU-TI METALLIZATION WITH TUNGSTEN STUDS, Journal of applied physics, 78(6), 1995, pp. 3756-3768

Authors: FILIPPI RG BIERY GA WACHNIK RA

Citation: Rg. Filippi et al., PARADOXICAL PREDICTIONS AND A MINIMUM FAILURE TIME IN ELECTROMIGRATION, Applied physics letters, 66(15), 1995, pp. 1897-1899