Authors: EIZENBERG M LITTAU K GHANAYEM S LIAO M MOSELY R SINHA AK

Citation: M. Eizenberg et al., CHEMICAL-VAPOR-DEPOSITED TICN - A NEW BARRIER METALLIZATION FOR SUBMICRON VIA AND CONTACT APPLICATIONS, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 13(3), 1995, pp. 590-595

Authors: EIZENBERG M LITTAU K GHANAYEM S MAK A MAEDA Y CHANG M SINHA AK

Citation: M. Eizenberg et al., TICN - A NEW CHEMICAL-VAPOR-DEPOSITED CONTACT BARRIER METALLIZATION FOR SUBMICRON DEVICES, Applied physics letters, 65(19), 1994, pp. 2416-2418