Authors: Goldstein, RV Sarychev, ME Shirabaikin, DB Vladimirov, AS Zhitnikov, YV

Citation: Rv. Goldstein et al., Modeling electromigration and the void nucleation in thin-film interconnects of integrated circuits, INT J FRACT, 109(1), 2001, pp. 91-121

Authors: Alexandrov, SE Goldstein, RV Tchikanova, NN

Citation: Se. Alexandrov et al., Upper bound limit load solutions for a round welded bar with an internal axisymmetric crack, FATIG FRACT, 22(9), 1999, pp. 775-780

Authors: Goldstein, RV Makhutov, NA

Citation: Rv. Goldstein et Na. Makhutov, Untitled, FATIG FRACT, 22(11), 1999, pp. 937-937

Authors: Alexandrov, SE Goldstein, RV

Citation: Se. Alexandrov et Rv. Goldstein, An upper bound limit load for overmatched scarf-joint specimens, FATIG FRACT, 22(11), 1999, pp. 975-979

Authors: Alexandrov, SE Goldstein, RV

Citation: Se. Alexandrov et Rv. Goldstein, Exact analytical solution to a rigid/plastic problem with hardening and damage evolution, CR AC S IIB, 327(2-3), 1999, pp. 193-199

Authors: Alexandrov, SE Goldstein, RV

Citation: Se. Alexandrov et Rv. Goldstein, Distributions of stress and plastic strain in notched tensile bars, INT J FRACT, 91(1), 1998, pp. 1-11