Authors: MCCLUSKEY FP HAKIM EB FINK J FOWLER A PECHT MG

Citation: Fp. Mccluskey et al., RELIABILITY ASSESSMENT OF ELECTRONIC COMPONENTS EXPOSED TO LONG-TERM NON-OPERATING CONDITIONS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(2), 1998, pp. 352-359

Authors: HAKIM EB

Citation: Eb. Hakim, PLASTIC ENCAPSULATED MICROCIRCUIT RELIABILITY PREDICITION - WHY, Microelectronics and reliability, 38(4), 1998, pp. 681-683

Authors: HAKIM EB

Citation: Eb. Hakim, WHY USE PEMS IN MILITARY EQUIPMENT - USERS RESPONSE, Microelectronics and reliability, 38(3), 1998, pp. 403-407

Authors: LALL P PECHT M HAKIM EB

Citation: P. Lall et al., CHARACTERIZATION OF FUNCTIONAL-RELATIONSHIP BETWEEN TEMPERATURE AND MICROELECTRONIC RELIABILITY, Microelectronics and reliability, 35(3), 1995, pp. 377-402