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Results: 1-11 |
Results: 11
EFFECT OF COMPONENT HETEROGENEITY ON GLOBAL CTE MISMATCH DISPLACEMENTIN AREAL-ARRAY SOLDER INTERCONNECTS
Authors: HEINRICH SM SHAKYA S LEE PS
Citation: Sm. Heinrich et al., EFFECT OF COMPONENT HETEROGENEITY ON GLOBAL CTE MISMATCH DISPLACEMENTIN AREAL-ARRAY SOLDER INTERCONNECTS, Journal of electronic packaging, 120(1), 1998, pp. 12-17
SHEARING DEFORMATION IN PARTIAL AREAL ARRAYS - ANALYTICAL RESULTS
Authors: HEINRICH SM SHAKYA S LEE PS
Citation: Sm. Heinrich et al., SHEARING DEFORMATION IN PARTIAL AREAL ARRAYS - ANALYTICAL RESULTS, Journal of electronic packaging, 120(1), 1998, pp. 18-23
IMPROVED ANALYTICAL ESTIMATE OF GLOBAL CTE MISMATCH DISPLACEMENT IN AREAL-ARRAY SOLDER JOINTS
Authors: HEINRICH SM SHAKYA S LEE PS
Citation: Sm. Heinrich et al., IMPROVED ANALYTICAL ESTIMATE OF GLOBAL CTE MISMATCH DISPLACEMENT IN AREAL-ARRAY SOLDER JOINTS, Journal of electronic packaging, 119(4), 1997, pp. 218-227
PREDICTION OF SOLDER GEOMETRY FOR AN AXISYMMETRICAL THROUGH-HOLE JOINT
Authors: ELKOUH AF RAMASUBRAMANIAN N HSU TF NIGRO NJ HEINRICH SM LEE PS SHANGGUAN D
Citation: Af. Elkouh et al., PREDICTION OF SOLDER GEOMETRY FOR AN AXISYMMETRICAL THROUGH-HOLE JOINT, Journal of electronic packaging, 119(4), 1997, pp. 268-274
IMPROVED YIELD AND PERFORMANCE OF BALL-GRID ARRAY PACKAGES - DESIGN AND PROCESSING GUIDELINES FOR UNIFORM AND NONUNIFORM ARRAYS
Authors: HEINRICH SM SHAKYA S WANG YH LEE PS SCHROEDER SA
Citation: Sm. Heinrich et al., IMPROVED YIELD AND PERFORMANCE OF BALL-GRID ARRAY PACKAGES - DESIGN AND PROCESSING GUIDELINES FOR UNIFORM AND NONUNIFORM ARRAYS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(2), 1996, pp. 310-319
SPECIAL ISSUE ON SOLDER GEOMETRY - FOREWORD
Authors: HEINRICH SM
Citation: Sm. Heinrich, SPECIAL ISSUE ON SOLDER GEOMETRY - FOREWORD, Journal of electronic packaging, 118(3), 1996, pp. 113-113
PREDICTION OF SOLDER JOINT GEOMETRIES IN ARRAY-TYPE INTERCONNECTS
Authors: HEINRICH SM SCHAEFER M SCHROEDER SA LEE PS
Citation: Sm. Heinrich et al., PREDICTION OF SOLDER JOINT GEOMETRIES IN ARRAY-TYPE INTERCONNECTS, Journal of electronic packaging, 118(3), 1996, pp. 114-121
PARAMETRIC FINITE-ELEMENT METHOD FOR PREDICTING SHAPES OF 3-DIMENSIONAL SOLDER JOINTS
Authors: NIGRO NJ ZHOU FJ HEINRICH SM ELKOUH AF FOURNELLE RA LEE PS
Citation: Nj. Nigro et al., PARAMETRIC FINITE-ELEMENT METHOD FOR PREDICTING SHAPES OF 3-DIMENSIONAL SOLDER JOINTS, Journal of electronic packaging, 118(3), 1996, pp. 142-147
MEMBRANE ANALOGY FOR SAINT-VENANT TORSION - NEW RESULTS
Authors: HEINRICH SM
Citation: Sm. Heinrich, MEMBRANE ANALOGY FOR SAINT-VENANT TORSION - NEW RESULTS, Journal of engineering mechanics, 122(11), 1996, pp. 1110-1112
AN APPROXIMATE MODEL FOR PREDICTING THE SIZE AND SHAPE OF WAVE-SOLDERED SURFACE-MOUNT JOINTS
Authors: NAMBISAN BU HEINRICH SM FOURNELLE RA ELKOUH AF NIGRO NJ LEE PS
Citation: Bu. Nambisan et al., AN APPROXIMATE MODEL FOR PREDICTING THE SIZE AND SHAPE OF WAVE-SOLDERED SURFACE-MOUNT JOINTS, JOURNAL OF ELECTRONICS MANUFACTURING, 5(3), 1995, pp. 217-233
DYNAMIC MODELING OF SLAB FORMWORK DURING CONCRETE PLACEMENT
Authors: KARSHENAS S HEINRICH SM
Citation: S. Karshenas et Sm. Heinrich, DYNAMIC MODELING OF SLAB FORMWORK DURING CONCRETE PLACEMENT, Journal of structural engineering, 120(7), 1994, pp. 2199-2217
Risultati: 1-11 |