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Results:
1-3
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Results: 3
Creep phenomena in lead-free solders
Authors:
Igoshev, VI Kleiman, JI
Citation:
Vi. Igoshev et Ji. Kleiman, Creep phenomena in lead-free solders, J ELEC MAT, 29(2), 2000, pp. 244-250
Fracture of Sn-3.5%Ag solder alloy under creep
Authors:
Igoshev, VI Kleiman, JI Shangguan, D Wong, S Michon, U
Citation:
Vi. Igoshev et al., Fracture of Sn-3.5%Ag solder alloy under creep, J ELEC MAT, 29(12), 2000, pp. 1356-1361
Microstructure changes in Sn-3.5Ag solder alloy during creep
Authors:
Igoshev, VI Kleiman, JI Shangguan, D Lock, C Wong, S Wiseman, M
Citation:
Vi. Igoshev et al., Microstructure changes in Sn-3.5Ag solder alloy during creep, J ELEC MAT, 27(12), 1998, pp. 1367-1371
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