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Results: 1-3 |
Results: 3

Authors: Igoshev, VI Kleiman, JI
Citation: Vi. Igoshev et Ji. Kleiman, Creep phenomena in lead-free solders, J ELEC MAT, 29(2), 2000, pp. 244-250

Authors: Igoshev, VI Kleiman, JI Shangguan, D Wong, S Michon, U
Citation: Vi. Igoshev et al., Fracture of Sn-3.5%Ag solder alloy under creep, J ELEC MAT, 29(12), 2000, pp. 1356-1361

Authors: Igoshev, VI Kleiman, JI Shangguan, D Lock, C Wong, S Wiseman, M
Citation: Vi. Igoshev et al., Microstructure changes in Sn-3.5Ag solder alloy during creep, J ELEC MAT, 27(12), 1998, pp. 1367-1371
Risultati: 1-3 |