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Results:
1-5
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Results: 5
Authors:
Braghieri, A
De Munari, I
Impronta, M
Scorzoni, A
Citation: A. Braghieri et al., Evaluation of the thermal resistance of Al-Cu electromigration test structures, MICROEL REL, 40(8-10), 2000, pp. 1317-1322
A proposal for a standard procedure for moderately accelerated electromigration tests on metal lines
Authors:
Scorzoni, A
Impronta, M
De Munari, I
Fantini, F
Citation: A. Scorzoni et al., A proposal for a standard procedure for moderately accelerated electromigration tests on metal lines, MICROEL REL, 39(5), 1999, pp. 615-626
Authors:
Kelaidis, N
Scorzoni, A
Impronta, M
De Munari, I
Citation: N. Kelaidis et al., A study of the thermal behavior of different test patterns used in differential high resolution electromigration measurements, MICROEL REL, 39(5), 1999, pp. 627-634
Authors:
Balboni, R
de Munari, I
Impronta, M
Scorzoni, A
Citation: R. Balboni et al., Additional microstructural analysis on the samples examined in the paper 'Are high resolution resistometric methods really useful for the early detection of electromigration damage?', MICROEL REL, 39(4), 1999, pp. 537-540
Authors:
Scorzoni, A
De Munari, I
Impronta, M
Kelaidis, N
Citation: A. Scorzoni et al., Early electromigration effects and early resistance changes, MICROEL REL, 39(11), 1999, pp. 1647-1656
Risultati:
1-5
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